Hybrid PCB Assembly

Материал сборки гибридной печатной платы Rogers RO3003 и TUC TU827

Название: Гибридный материал сборки печатной платы Rogers RO3003 и TUC TU827
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Базовый материал: FR-4/алюминий/ceM-1/cem-3/FR-1
Толщина меди: 1 унция
Поверхностная обработка: HASL, не содержит свинца
Слой: 1~16 слоев
Паяльная маска: зеленая, желтая, синяя, белая, черная, Nanya & Taiyo, LPI и матовая красная,

Hybrid PCB Assembly is an advanced electronic manufacturing process that involves the integration of different technologies and components onto a single printed circuit board (PCB). It combines both surface mount technology (SMT) and through-hole technology (THT) assembly methods. It also allows for the incorporation of diverse components and functionalities.

Hybrid PCB Assembly offers the flexibility to combine the benefits of SMT, which enables high component density and compactness, with THT, which provides robust mechanical connections and higher power handling capabilities. This combination makes it ideal for applications where a mix of components with varying requirements is needed.

The assembly process for Hybrid PCBs involves the placement and soldering of SMT components on one side of the PCB, while THT components are inserted through pre-drilled holes on the opposite side and soldered manually or with wave soldering techniques. The combination of SMT and THT allows for a wider range of components. It includes ICs, resistors, capacitors, connectors, transformers, and more.

Advantages of Hybrid PCB Assembly:

  1. Component Flexibility: Hybrid Assembly offers the flexibility to incorporate a wide range of components, including both SMT and THT components. This allows for the integration of components with different form factors, power ratings, and specialized functionalities on a single PCB, making it suitable for diverse application requirements.
  2. Design Versatility: Hybrid Assembly provides design versatility, enabling engineers to optimize the layout and functionality of the PCB. The combination of SMT and THT technologies allows for greater flexibility in component placement, routing, and thermal management. This also results in improved overall design efficiency.
  3. Higher Component Density: By utilizing SMT technology, Hybrid Assembly enables higher component density compared to traditional THT-only assemblies. This allows for compact PCB designs, which are particularly beneficial in space-constrained applications.
  4. Mechanical Stability: THT components, with their leads passing through pre-drilled holes and soldered on the opposite side of the PCB, provide enhanced mechanical stability and durability. This makes Hybrid PCBs suitable for applications that require robust connections, resistance to mechanical stress, or exposure to vibrations.
  5. Power Handling Capabilities: THT components can handle higher power levels compared to their SMT counterparts. By incorporating THT components in a Hybrid Assembly, it becomes possible to accommodate higher power requirements, such as power amplifiers, transformers, or high-current connectors.

 

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP
https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-1.webp

Automatic Solder Paste Printing Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-2.webp

AOI Optical Inspection

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-3.webp

Smt High-Speed Placement Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-4.webp

Nitrogen Reflow Soldering

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-5.webp

X-Ray

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Three Anti-Paint Spraying Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-7.webp

SPI Solder Paste Thickness Tester

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-8.webp

Automatic Wave Soldering Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-9.webp

First Article Inspection

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