Односторонние печатные платы PCBA
Название: Односторонние печатные платы PCBA
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 1/3 унции – 4 унции или на заказ
Материал: ФР4
Паяльная маска: зеленая, синяя, белая, красная и т. д.
Толщина платы: по индивидуальному заказу
Одиночная двухсторонняя пайка SMT оплавлением
Название: Одиночная двусторонняя пайка SMT оплавлением
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Обработка поверхности: HASL, HAL-LF, OSP, ENIG
Паяльная маска: зеленая, синяя, белая, черная, серая, красная, желтая, фиолетовая.
Материал: FR4/алюминий
Однослойная печатная плата ST серии
Имя: Однослойная печатная плата лампы ST серии ster
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL, не содержит свинца
Применение: Промышленное ламповое оборудование.
Материал: FR4/алюминий
Толщина меди: 1-5 унций
Паяльная маска: зеленая, синяя, белая, черная, серая, красная, желтая, фиолетовая.
Односторонняя печатная плата в сборе OEM Pcb и Pcba
Имя: Односторонняя сборка печатной платы OEM Pcb & Pcba
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL/без свинца
Применение: сервис pcba
Базовый материал: RF4
Толщина платы: по индивидуальному заказу
Однослойная и многослойная печатная плата для радиоуправления
Название: Однослойная и многослойная печатная плата для радиоуправления
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: ENIG,HASL,OSP,ENEPIG
Размер платы: индивидуальный
Цвет паяльной маски: Желтый PI
Применение: связь
Односторонняя печатная плата со светодиодами в сборе
Название: Односторонняя сборка печатной платы со светодиодами
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Количество слоев: 4-слойный
Основной материал: FR4, CEM3, PTFE, алюминий и т. д.
Поверхностная обработка: HASL, OSP, иммерсионное золото/олово
Паяльная маска: зеленая, черная, синяя, красная, матовая зеленая.
Применение: Электронное устройство
- PCB Assembly Capability
- PCB Assembly Equipment
Our Single-Sided PCB Assembly service provides a cost-effective and efficient solution for your electronic assembly needs. With our state-of-the-art equipment and skilled technicians, we offer reliable assembly of single-sided printed circuit boards (PCBs) with precision and quality.
Single-sided PCBs are ideal for simple electronic designs and applications that require fewer components. Our assembly process ensures that each component is expertly placed and soldered onto the single copper layer, guaranteeing optimal electrical conductivity and performance.
Advantages of Single-sided PCB assembly:
- Cost-effective: Single-sided PCBs are more economical compared to multi-layered boards. They require fewer materials and involve simpler manufacturing processes, resulting in cost savings without compromising quality.
- Simplified assembly: With only one layer of components and traces, the assembly process is straightforward and streamlined. This reduces the complexity of the assembly, minimizing the chances of errors and facilitating faster production cycles.
- Quick prototyping: Single-sided PCB assembly is an excellent choice for rapid prototyping. With fewer components and simpler designs, you can accelerate the development cycle and quickly validate your electronic concepts.
- Space-efficient: Single-sided PCBs are compact and space-efficient. They are suitable for applications where size constraints are a concern, such as portable devices or space-limited electronic systems.
- Versatility: Despite their simplicity, single-sided PCBs can still accommodate a wide range of electronic components and support various functionalities. They are suitable for applications that do not require complex circuitry or high-density designs.
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um–175um | 8.75um–280um |
Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |